Could use some headset advice...

Ice Storm I hate to say it but after making the first suggestion of thermal paste drying out. I'm like seriously since when is that a problem from time to time on PC's My old comp is still running in my brother in laws basement. We put the sink paste
on that IDK like 9-10 years ago and that's an AMD.

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Bashing someone else's opinion isn't necessary when yours isn't any better really. I'm calling BS cause you should know there is no shrinkage in the silicone / silver compound used to bind the heat sink to the cpu even though hardening occurs no if's ands
or buts.

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I would chalk a faulty console up to cheap parts. Or something like they water'd down the heat sync paste. The error lies in parts and labor. Thats why xbox has such a large warranty time slot. Cause every body knows this. I belive Nano actually know's
and is educated to the facts of XBOX's specs. I can't say he's 100% accurate cause I just don't know for certain.

[quote user="NanoTechSoldier"]You must, because you have no understanding on what was said & explained to you in plain English...[/quote]You aren't using plain english. You're using buzzwords that you're frantically picking up from articles written years
ago in an attempt to re-write the history of the 360 and the console industry in general.

Even a child, could of understood what was said...

I weep for any children who read what you write.

You repeatedly drag threads off-topic with meaningless buzzword-laden comments that have nothing to do with what people are asking. While I try and correct the most egregious errors on your part, you refuse to read any evidence presented to you and just
go prattling on.

For the last time IceStorm III, as you seriously are not getting me...

.

The Xbox 360 Slims, might be Block restricted to "Simulate" the previous models performance...

BUT, the first 90nm Processers, didn't perform like they should of, due to current leakage (Performance Drop) & were die shrunk, to solve that problem...

Every new Console, that was released & had a reduction in die size, would perform better than the last, as the current leakage was less & performance of the Processor increased or it was able to hold it closer to the intended performance level etc.. That
trend continues from 90nm all the way down to the new Combined XCGPU Chipset in the Slim Consoles of 45nm, which can keep the intended level of performance at a steady level & also being able to procecess the data more efficiently, in they way the chipset
being redesigned completely to run of a single die...

If you can't get, what i'm saying here..

Think of a bucket for the consoles released, as bucket with a hole (90nm Processors), that is being filled with water & a bucket with no holes (XCGPU 45nm), filled with water & see what bucket fills first or holds the water... I see a logical performance
gain with every new console or die shrink, Don't you....?????

[quote user="NanoTechSoldier"]

Whatever you reckon LostKauz...

[/quote]No problem and watch the 1 Star thing... ennhh ennnhh ennhhhh... (if it was you and if not sorry)

You obviously, have clue how computer circuitry works then IceStorm III... Because, even if the Slim console "Simulates" the older consoles performance, it still processes it more cleanly, than the older consoles..

Another thing, what Motherboard, did they "Simulate"..?? was it the Jasper chipset or the Xenon Chipset...??? Because, everyone knows, there were performance benefits, from owning a 65nm/65nm Jasper console over a 90nm/90nm Launch console etc... =P